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鞋用冷却装置3d模型: 外挂式鞋用半导体循环制冷装置整体结构,外挂主机尺寸严格 50mm×50mm×22mm,蓝牙耳机盒大小,通过魔术贴固定于鞋外侧脚踝下方; 连接扁平双腔医用硅胶管路 | Tripo AI

鞋用冷却装置3d模型

Prompt

外挂式鞋用半导体循环制冷装置整体结构,外挂主机尺寸严格 50mm×50mm×22mm,蓝牙耳机盒大小,通过魔术贴固定于鞋外侧脚踝下方; 连接扁平双腔医用硅胶管路,管路总长度 400mm,总宽度 7.5mm,总厚度 1.5mm; 管路为预弯弧形一体结构,分为脚踝连接段弧形角度 120°,脚背输送段平直微弧形,鞋头吸气段弧形角度 90°; 管路沿鞋外侧帮面边缘→横向穿过脚背中部→延伸至鞋头前端,全程贴附鞋内衬无骨骼压迫区,不接触脚踝骨、跖骨、脚趾关节;

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