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DCC Bridge
Anonymous1776784900
04-22 17:08
Model Name
modelo 3d de cpu
Tags
machine
rendering
realistic
Prompt
A precise, hyper-realistic laser cutaway 3D model of a PC CPU. The processor is sliced down the middle to reveal its internal anatomy in cross-section. Clearly show the thickness of the metal copper heat spreader, the thin layer of thermal interface material, and the silicon chip bonded to the substrate PCB. Visible gold pins/pads on the bottom. Micro-engineering detail, high contrast materials, metallic silver and gold tones IHS (Integrated Heat Spreader): Cobre chapado en níquel. Disipa el calor del die. TIM (Thermal Interface Material): Pasta térmica o metal líquido entre el Die y el IHS. Die (El chip de Silicio): Litografía (ej. 5nm, 7nm). Contiene los núcleos (Cores), Cache L1/L2/L3, I/O Die y controlador de memoria. Substrato: Placa de fibra de vidrio que conecta el silicio con los pines externos. LGA/PGA (Pines/Pads): Puntos de contacto dorados para la placa base.
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