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Anonymous1783785413
07-13 13:30
Model Name
phone enclosure 3d model
Tags
3d printing
3d printing realistic
props
props 3d printing
props 3d printing realistic
props realistic
realistic
Prompt
Design a 3D-printable electronics enclosure for a Vivo Y15 smartphone motherboard. The enclosure must be made for ABS plastic with 2 mm wall thickness. External dimensions should be 70 mm × 50 mm × 25 mm. Create a removable screw-on top cover with four M2 screw holes. Include four internal motherboard standoffs for a motherboard approximately 60 mm × 43 mm. Add a battery compartment below the motherboard. Add a top-mounted 30 × 30 × 10 mm fan mount centered over the CPU area with honeycomb ventilation. Include side ventilation slots, a Micro-USB charging port opening, power button access, ribbon cable clearance, and rounded 5 mm corner radii. The design must be optimized for FDM 3D printing in black ABS plastic with no unnecessary supports.
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Anonymous1783785413
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