high-end cpu 3d model

Generate an ultra-high-definition, photorealistic 3D model of a cutting-edge flagship server-grade CPU (Central Processing Unit) from a top-tier semiconductor manufacturer. The chip must feature a large, square-shaped metallic IHS (Integrated Heat Spreader) made of brushed nickel-plated copper, exhibiting subtle scratch marks, minor thermal paste residue stains, and realistic metallic anisotropy for extreme realism. Beneath the IHS, the visible edge should reveal a multi-layered organic solderability preservative (OSP) coated PCB substrate in a deep emerald green color, with visible fiberglass weave textures. The bottom side must showcase a dense, perfectly aligned grid of LGA (Land Grid Array) gold-plated contact pins, with varying microscopic heights, subtle oxidation spots, and gold sheen. Surrounding the central die area, populate the substrate with dozens of microscopic SMD ceramic multilayer chip capacitors (MLCCs) in matte beige and glossy black, alongside tiny platinum-colored