shoe sole electronics 3d model

Shoe-shaped midsole functional integration module, ergonomic insole-like form following the natural arch of the foot, 8-10 mm thick, black or dark gray flexible composite material, smooth rounded edges, one-piece molded structure. Embedded electronic components visible on the surface: a large rectangular main processor chip located in the heel area, multiple circular pressure sensor nodes distributed across forefoot and midfoot, small wireless communication module, auxiliary circuit boards, fine gold PCB traces connecting all components. Components are flush-mounted into the surface, symmetrical and neatly arranged, realistic engineering layout, high-tech industrial design aesthetic, suitable as the core middle layer of a smart elderly positioning shoe sole. Isolated on clean white background, studio lighting, photorealistic, ultra detailed 3D CAD model.