electronics enclosure 3d model

Design a functional 3D-printable electronics enclosure blockout for two components: Seeed Studio ReSpeaker XVF3800 4-mic array (108x108x18mm) and Beelink SER5 mini PC (5x4.5x1.75in). Create a rectangular dual-chamber enclosure: upper chamber for mic array, lower chamber for mini PC, fully separated. Requirements: Simple engineering geometry, no organic shapes Front mic area with perforated acoustic vent panel Mic chamber unobstructed and isolated from heat/vibration Lower chamber with side intake vents and opposite exhaust airflow Internal clearance for devices and cable routing (USB, HDMI, power) Rear cutouts for ports and cable exit channel Modular design with 2–3 separable parts (top/front/base) FDM 3D-printable with flat faces and simple walls Stable base and clear internal cavities. Add ~0.5–1mm clearance tolerance. Style: mystical artifact with subtle Celtic-inspired visuals or vent patterning while preserving airflow and sound clarity. Components should not be easily visible.